Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module …

Resonac’s non-UV-type adhesive tape has been used to secure parts during the dicing process of manufacturing semiconductors, electronic devices and optical components. The product has been …

For over 40 years Semiconductor Equipment Corporation has set the standard for high quality semiconductor Dicing Tape. We inventory a variety of tapes which are manufactured specifically for …

Our UV dicing tapes feature a polyethylene or polyvinyl chloride base film and UV releasable adhesive to secure silicon wafers during dicing and die sorting processes. They provide excellent cutting …

Achieves high reliability by combining dicing and die attachment functions. This adhesive film is for fixing IC chips to a lead frame or interposer in the semiconductor assembly process.

For silicon, glass, and mold resin Dicing tape This tape is used to hold semiconductor wafer during dicing/singulation process.

A dicing tape is used for fixing a work piece during the dicing process in the manufacturing of semiconductors, electronic and optical components. With greater diversity and higher quality in …

Our No.6360 series constitutes a dicing tape crafted by applying a UV release adhesive onto a highly isotropic polyolefin base material. This tape ensures secure fixation of workpieces during dicing, …

Dicing tapes are specialized tapes designed for use during the above process. They are thin, flexible, and have a strong adhesion layer. The tape's main purpose is to support the wafer. By providing a …

New Die-Attach film availability: AIT is now producing wafer die-attach film in wafer sizes up to 12-inches in combination with dicing tape in reel-to-reel format.